Circuit film with bump, film package using the same, and related fabrication methods

ABSTRACT

A circuit film having film bumps is provided for a film package. An IC chip is mechanically joined and electrically coupled to the circuit film through the film bumps instead of conventional chip bumps. In a fabrication method, a base film is partially etched by a laser to create an etched area that defines raised portion relatively raised from the etched area. Then a circuit pattern is selectively formed on the base film, partly running over the raised portions. The raised portion and the overlying circuit pattern constitute the film bumps having a height not greater than the height of the circuit film.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional of U.S. patent application Ser. No. 11/1 58,164,filed on Jun. 20, 2005, now pending, which claims priority under 35U.S.C. § 119 from Korean Patent Application No. 2004-48184, which wasfiled in the Korean Intellectual Property Office on Jun. 25, 2004, thecontents of which are incorporated by reference herein in theirentirety.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates generally to electronic packagingtechnology and, more particularly, to a semiconductor package using acircuit film as a substrate.

2. Description of the Related Art

With the current trend of high integration in semiconductor devices,related assembly technology for packaging and interconnecting thesemiconductor devices is becoming increasingly important. Consequently,there is a growing tendency to make semiconductor packages smaller,thinner, lighter, and more multifunctional. For example, the increasedmarket demands for mobile handsets and liquid crystal displays (LCDs)have influenced semiconductor packaging. To meet these needs, severaltypes of packages using a circuit film as a substrate have beendeveloped and introduced in the art.

FIGS. 1A to 1C show cross-sectional views of a conventional circuit film10 and a related fabrication process. Referring to FIGS. 1A to 1C, thecircuit film 10 is based on a thin, flexible, insulating base film 11. Acircuit pattern 12 is formed on the base film 11 and then coated with ametal coating layer 13. A resultant structure on the base film 11 iscovered with a protective layer 14 except one end of each circuitpattern 12 coated with the metal layer 13. The non-covered end of thecircuit pattern 12 is then connected with an integrated circuit (IC)chip.

FIG. 2 illustrates a cross-sectional view of a conventional film package30 using the circuit film 10. This illustrates a chip-on-film (COF)package. As shown in FIG. 2, the circuit pattern 12 is connected with achip bump 23 of the IC chip 20. The IC chip 20 has a number ofinput/output (I/O) pads 22 on an active surface 21, with a chip bump 23formed on each I/O pad 22. In addition, a sealing resin 31 between thecircuit film 10 and the IC chip 20 protects and supports the circuitpattern 12 and the chip bump 23.

As discussed, in a conventional film package 30 the chip bumps 23physically join and electrically couple the circuit film 10 and the ICchip 20. Typically, the chip bumps 23 are made of gold, solder, or othervarious metals, and have a desired height.

FIGS. 3A to 3C show, in cross-sectional views, a conventional method offorming the chip bumps 23. Referring to FIGS. 3A to 3C, first of all, anunder bump metal (UBM) 24 is deposited on the active surface of the ICchip 20. Then, a photoresist material is coated on the UBM 24 andpatterned to form a photoresist pattern 25 exposing the I/O pads 22.Next, a bump material is plated on the I/O pads 22 through thephotoresist pattern 25 to form the chip bumps 23. Thereafter, thephotoresist pattern 25 is removed, and the UBM 24 is selectively etchedusing the chip bumps 23 as an etching mask.

Since the conventional film package 30 uses the chip bumps 23 formed bythe above-discussed method, related fabrication processes may becomplicated and lengthy, and fabrication cost may be increased.

SUMMARY OF THE INVENTION

Exemplary embodiments of the present invention include a new andimproved circuit film, a film package using the circuit film, andrelated fabrication methods.

According to an embodiment, a circuit film may comprise a base film, atleast one raised portion in the base film, and a circuit patternselectively formed on the base film and partly running over the raisedportion. In the circuit film, the raised portion and the overlyingcircuit pattern may constitute film bumps.

In the circuit film, the base film may have an etched area defining theraised portion. A first thickness of the base film at the raised portionmay be substantially equal to a second thickness of the base filmoutside the etched area. The first and second thickness of the base filmmay be about 35 μm to about 40 μm. A relative height of the raisedportion from the etched area may be about 3 μm to about 20 μm. Thecircuit pattern may have a metal coating layer formed thereon. Thecircuit pattern may be formed of copper, and example metal coatinglayers may be formed of tin or nickel/gold.

According to an embodiment, a method of fabricating a circuit film maycomprise partially etching a base film to create an etched area definingat least one raised portion relatively raised from the etched area, andselectively forming a circuit pattern on the base film, where thecircuit pattern may partly run over the raised portion. In the circuitfilm, the raised portion and the overlying circuit pattern mayconstitute film bumps.

In a method of fabricating the circuit film, a laser may partially etchthe base film. The laser may remove the base film to a specific depth,for example, a specific depth per one shot of the laser. An examplelaser may be an eximer laser having energy of about 1000 mJ/cm2 andfrequency of about 300 Hz. Selectively forming the circuit pattern mayinclude forming a metal coating layer on the circuit pattern.Electroplating may be used to form the circuit pattern. Electrolessplating may used to form the metal coating layer.

According to an embodiment, a film package may comprise a circuit film,an integrated circuit (IC) chip, and a sealing resin. The circuit filmmay have at least one raised portion formed in a base film, and may havea circuit pattern formed on the base film and partly running over theraised portion. The raised portion and the overlying circuit pattern mayconstitute film bumps. The IC chip may have input/output (I/O) padsmechanically joined and electrically coupled to the film bumps. Thesealing resin may fill a space between the circuit film and the IC chipand surround the film bumps and the I/O pads.

In the film package, the base film may have an etched area defining theraised portion. The base film at the raised portion may have a firstthickness substantially equal to a second thickness of the base filmoutside the etched area. The circuit pattern may have a metal coatinglayer formed thereon. Each I/O pad may have a metal coating layer or abump formed thereon. The sealing resin may be a non-conductive resin oran anisotropic conductive resin in which a non-conductive resin containsa number of conductive particles.

According to an embodiment, a method of fabricating a film package maycomprise fabricating a circuit film having film bumps, forming a sealingresin on the circuit film, and attaching an integrated circuit (IC) chipto the circuit film. Fabricating the circuit film may include partiallyetching a base film to create an etched area defining at least oneraised portion relatively raised from the etched area, and selectivelyforming a circuit pattern on the base film, the circuit pattern partlyrunning over the raised portion, the raised portion and the overlyingcircuit pattern constituting the film bumps. By attaching the IC chip tothe circuit film, input/output (I/O) pads of the IC chip may bemechanically joined and electrically coupled to the film bumps, and thesealing resin can surround the film bumps and the I/O pads.

In the method of fabricating the film package, a laser may partiallyetch the base film. Selectively forming the circuit pattern may includeforming a metal coating layer on the circuit pattern. The attaching theIC chip to the circuit film may include placing the I/O pads on the filmbumps, and curing the sealing resin to support the I/O pads and the filmbumps. Alternatively, attaching the IC chip to the circuit film may beperformed by a number of conductive particles contained in the sealingresin.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A to 1C are cross-sectional views showing a conventional circuitfilm and a related manufacturing process.

FIG. 2 is a cross-sectional view of a conventional film package.

FIGS. 3A to 3C are cross-sectional views showing a conventional methodof forming chip bumps.

FIG. 4 is a cross-sectional view showing a circuit film and a filmpackage in accordance with an embodiment of the present invention.

FIGS. 5A to 8B are views showing a method of fabricating a circuit filmin accordance with another embodiment of the present invention, wherein:

FIGS. 5A and 5B are a plan view and a cross-sectional view,respectively, showing a partial etching of a base film to form raisedportions for film bumps;

FIG. 6 is a plan view showing another example of the raised portions;

FIGS. 7A and 7B are a plan view and a cross-sectional view,respectively, showing forming a circuit pattern on the circuit film; and

FIGS. 8A and 8B are a plan view and a cross-sectional view,respectively, showing forming a protective layer on the circuit film.

FIGS. 9A to 10B are views showing a method of fabricating a film packagein accordance with yet another embodiment of the present invention,wherein:

FIGS. 9A and 9B are a plan view and a cross-sectional view,respectively, showing applying a sealing resin to the circuit film; and

FIGS. 10A and 10B are a plan view and a cross-sectional view,respectively, showing attaching an IC chip to the circuit film.

FIG. 11 is a cross-sectional view of a film package in accordance withstill another embodiment of the present invention.

FIG. 12 is a perspective view showing a mounting structure of the filmpackage in accordance with an embodiment of the present invention.

DETAILED DESCRIPTION OF EMBODIMENTS OF THE PREFERRED EMBODIMENTS

Embodiments of the present invention will now be described more fullywith reference to the accompanying drawings. This invention may,however, be embodied in many different forms and should not be construedas limited to the embodiments herein. Rather, the disclosed embodimentsare provided so that this disclosure will be thorough and complete. Theprinciples and feature of this invention may be employed in varied andnumerous embodiments without departing from the scope of the invention.

In this disclosure, well-known structures and processes are notdescribed or illustrated in detail to avoid obscuring the presentinvention. Furthermore, the figures are not drawn to scale; rather, forsimplicity and clarity of illustration, the dimensions of some of theelements are exaggerated relative to other elements. Like referencenumerals are used for like parts of the various drawings.

FIG. 4 shows, in a cross-sectional view, a circuit film 40 and a filmpackage 60 in accordance with an embodiment of the present invention.

Referring to FIG. 4, the circuit film 40 and an IC chip 50 aremechanically joined and electrically coupled to each other by means offilm bumps 46 provided in the circuit film 40. The film bumps 46 mayhave raised portions 43 and a circuit pattern 45. The raised portions 43may be partly formed in a base film 41 of the circuit film 40, and thecircuit pattern 45 may run over the raised portions 43. Since thecircuit pattern 45 is typically formed on the circuit film 40, thecircuit film 40 only needs the raised portions 43 to have the film bumps46. In other words, the film bumps 46 can be easily added during thefabrication of the circuit film 40. Therefore, the entire process offabricating the film package 60 is simplified and cost-effective.

FIGS. 5A to 8B show a method of fabricating the circuit film 40. Thestructure of the circuit film 40 is clarified in the followingdescription.

FIG. 5A is a plan view showing partial etching of the base film 41 toform the raised portions 43 for the film bumps 46. FIG. 5B is across-sectional view taken along line VB-VB of FIG. 5A.

Referring to FIGS. 5A and 5B, the base film 41 may be partially etchedsuch that an etched area 42 is created in one surface of the base film41 to define specific non-etched portions. For example, by depressedengraving the base film 41, the non-etched, relatively raised portions43 are formed within the etched area 42. A first thickness (t1) of thebase film 41 at the raised portions 43 may be substantially equal to asecond thickness (t2) of the base film 41 outside the etched area 42.This allows formation of the film bumps (46 in FIG. 4) to not increase aheight of the circuit film 40. The base film 41 may be a flexible,electrically insulating, optionally transparent, film such as apolyimide film. An example base film 41 may have a thickness of about 35μm to about 40 μm, preferably, about 38 μm.

A laser may perform the partial etching of the base film 41. The lasermay generate a focused output beam and irradiate the output beam to atarget area of the base film 41. The target area exposed to the laserbeam may therefore be removed to a specific depth, creating the etchedarea 42 and thereby defining the raised portions 43. The laser used forthe partial etching may be an eximer laser, for example, having energyof about 1000 mJ/cm2 and frequency of about 300 Hz. This example eximerlaser may remove the base film 41 to about 0.45 μm per one shot. It willbe appreciated that the disclosed laser is exemplary only, and othersuitable lasers may alternatively be used.

The etched depth of the base film 41 determines the relative height ofthe raised portions 43, i.e., the film bump 46. Example etched depths ofthe base film 41 may range from about 3 μm to about 20 μm, and thereforethe height of the raised portions 43 may be substantially the same.Since the film bump 46 will meet the I/O pads 52 as shown in FIG. 4, theposition of the raised portions 43 depends on that of the I/O pads 52.In addition, the raised portions 43 may be formed in a continuousfashion, as shown in FIG. 5A, corresponding to a row of the I/O pads, oralternatively may be formed in a discontinuous fashion, as shown in FIG.6, corresponding to each I/O pad.

The raised portions 43 may have at least one resin outlet 44, as shownin FIGS. 5A and 6. By the resin outlet 44, an inner etched area 42 asurrounded with the raised portions 43 communicates with an outer etchedarea 42 b. The resin outlet 44 may be used as a path permitting aninflow of a sealing resin (61 in FIG. 4) when the IC chip issubsequently attached to the circuit film 40.

After the raised portions 43 are formed, a suitable circuit pattern maybe formed. FIG. 7A is a plan view showing formation of the circuitpattern 45 on the circuit film 40. FIG. 7B is a cross-sectional viewtaken along line VIIB-VIIB of FIG. 7A.

Referring to the examples in FIGS. 7A and 7B, a circuit pattern 45 maybe formed on the surface, and raised portions 43 are formed within thebase film 41. The circuit pattern 45 may be made of electricallyconductive material such as copper. For example, a copper layer may beplated on the base film 41, for example by electroplating, and then maybe patterned by photolithography. Additionally, a relatively thin seedlayer (not shown) may be deposited on the base film 41 before the copperlayer is plated. The circuit pattern 45 may have a thickness of about 5μm to about 15 μm, preferably, between 8 μm and 12 μm. The seed layermay be formed of metal such as chromium and nickel, and may have athickness of about 1 μm or even less.

A part of the circuit pattern 45 may run over the raised portions 43.The raised portions 43 and the overlying circuit pattern 45 constitutethe film bumps 46. Therefore, the film bumps 46 can be easily formedduring the fabrication of the circuit film 40. Such process of formingthe film bumps 46 is simpler and more cost-effective than theconventional method of forming the chip bumps.

The circuit pattern 45 may be coated with a metal coating layer 47. Themetal coating layer 47 may enhance a stable joint between the film bumps46 and the I/O pads (52 in FIG. 4). Example metal coating layers 47 maybe formed of tin (Sn) or nickel/gold (Ni/Au), which may be plated with athickness of several microns and then patterned. Electroless plating maybe used for plating the metal coating layer 47.

After the circuit pattern 45 is formed, a protective layer may beformed. FIG. 8A is a plan view showing formation of the protective layer48 on the circuit film 40. FIG. 8B is a cross-sectional view taken alongline VIIIB-VIIIB of FIG. 8A.

Referring to FIGS. 8A and 8B, the protective layer 48 may be formed onthe surface of the base film 41, where the circuit pattern 45 is formed,except a region for receiving an IC chip. The protective layer 48 may beformed of solder resist material.

The circuit Film 40, fabricated by the above-discussed method, may beused for the film package. FIGS. 9A to 10B are views showing a method offabricating the film package 60 in accordance with yet anotherembodiment of the present invention. The structure of the film package60 is clarified in the following description.

FIG. 9A is a plan view showing application of the sealing resin 61 tothe circuit film 40. FIG. 9B is a cross-sectional view taken along lineIXB-IXB of FIG. 9A.

Referring to FIGS. 9A and 9B, the sealing resin 61 may be applied to thechip-receiving region and surrounded with the protective layer 48 of thecircuit film 40. The sealing resin 61 may be a non-conductive resin suchas epoxy resin and acrylate resin. The sealing resin 61 may be paste orfilm. While the paste resin may be formed by dispensing, the film resinmay be formed by attaching. The sealing resin 61 protects and supportsconnections between the circuit film 40 and the IC chip 50.

After the sealing resin 61 is formed, the IC chip 50 may be attached tothe circuit film 40. FIG. 10A is a plan view showing attachment of theIC chip 50 to the circuit film 40. FIG. 10B is a cross-sectional viewtaken along line XB-XB of FIG. 10A.

Referring to FIGS. 10A and 10B, the circuit film 40 and the IC chip 50are connected to each other through the film bumps 46 and the I/O pads52. An example IC chip 50 may be a driver device for driving a liquidcrystal display (LCD) panel, but is not so limited. The IC chip 50 has anumber of I/O pads 52 arranged on an active surface. Example I/O pads 52may be formed of aluminum (Al) or copper (Cu).

In a process of attaching an IC chip 50, the active surface of the ICchip 50 may face the circuit film 40. Then the IC chip 50 may be alignedwith the circuit film 40 such that the I/O pads 52 coincide with thefilm bumps 46. Next, the I/O pads 52 may be placed on and joined to thefilm bumps 46 with suitable heat and pressure, and further, the sealingresin 61 may surround the I/O pads 52 and the film bumps 46, filling aspace between the IC chip 50 and the circuit film 40. The sealing resin61 may then be cured, so the I/O pad 52 and the film bumps 46 arefixedly supported by the sealing resin 61 and electrically coupled toeach other.

In an embodiment, another type of sealing resin may be favorably usedfor attaching the IC chip 50 to the circuit film 40. FIG. 11 shows, in across-sectional view, a film package 60 using another sealing resin 62.

Referring to FIG. 11, the sealing resin 62 of this embodiment may be ananisotropic conductive resin in which a non-conductive resin 62 acontains a number of conductive particles 62 b. When the IC chip 50 isattached to the circuit film 40, the conductive particles 62 b may beinterposed between the I/O pads 52 and the film bumps 46, therebyproviding electrical paths. This type sealing resin 62 may also beprovided as a paste or film.

In another embodiment, the metal coating layer 47 on the circuit pattern45 may be formed also on the I/O pads 52. In addition, if necessary, theI/O pads 52 may further have gold or solder bumps formed thereon. Suchbumps may have a height of about 5 μm and less.

An example film package 60 fabricated by the above-discussed method maybe mounted on an LCD module. FIG. 12 shows, in a perspective view, amounting structure of the film package 60. It will be appreciated,however, this structure shown in FIG. 12 is exemplary and not alimitation of other embodiments of the invention. Since the LCD modulehas been well known in the art and is not necessary to understand theinvention, a detailed illustration and description of the LCD module isomitted.

Referring to FIG. 12, a film package 60 may be mounted on both an LCDpanel 71 and a printed circuit board (PCB) 72. The LCD panel 71 may becomposed of two boards, e.g., a thin film transistor (TFT) board 73 anda color filter board 74. The circuit pattern 45 of the circuit film 40acts as terminals of the package 60, and may be electrically coupled tothe TFT board 73 and the PCB 72. Specifically, output terminals of thecircuit pattern 45 are coupled to input pads of the TFT board 73, andinput terminals of the circuit pattern 45 are coupled to output pads ofthe PCB 72.

While this invention has been particularly shown and described withreference to exemplary embodiments, it will be understood that variouschanges in form and details may be made without departing from thespirit and scope of the invention as defined by the appended claims.

1. A method of fabricating a circuit film, the method comprising:etching a base film to create at least one raised portion; andselectively forming a circuit pattern on the base film, the circuitpattern partly on the raised portion, wherein the raised portion and thecircuit pattern constitute at least one film bump.
 2. The method ofclaim 1, wherein etching the base film is performed by a laser.
 3. Themethod of claim 2, wherein the laser removes the base film to a specificdepth per one shot.
 4. The method of claim 3, wherein the laser is aneximer laser having energy of about 1000 mJ/cm2 and frequency of about300 Hz.
 5. The method of claim 1, wherein selectively forming thecircuit pattern includes forming a metal coating layer on the circuitpattern.
 6. The method of claim 1, wherein selectively forming thecircuit pattern is performed by electroplating.
 7. The method of claim5, wherein forming the metal coating layer is performed by electrolessplating.
 8. A method of fabricating a film package, the methodcomprising: fabricating a circuit film having film bumps, includingpartially etching a base film to create at least one raised portionraised from the etched area, and forming a circuit pattern on the basefilm, the circuit pattern partly on the raised portion, the raisedportion and the overlying circuit pattern comprising the film bumps;placing a sealing resin on the circuit film; and attaching an integratedcircuit (IC) chip to the circuit film such that input/output (I/O) padsof the IC chip are mechanically joined and electrically coupled to thefilm bumps.
 9. The method of claim 8, wherein partially etching the basefilm is performed by a laser.
 10. The method of claim 8, whereinselectively forming the circuit pattern includes forming a metal coatinglayer on the circuit pattern.
 11. The method of claim 8, whereinattaching the IC chip to the circuit film includes placing the I/O padson the film bumps, and curing the sealing resin to support the I/O padsand the film bumps.
 12. The method of claim 8, wherein attaching the ICchip to the circuit film is performed by a number of conductiveparticles in the sealing resin.